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Manufacturing/Fabrication Support Services Marketing Brochur
Updated:2011-10-23 Category:Hardware
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Space Hardware Packaging and Assembly Group Support Services

Overview

Under NASA Code 500, the Applied Engineering and Technology Directorate (AETD), Code 560’s Space Hardware Packaging and Assembly Group has been serving Goddard Space Flight Center (GSFC) since 1989. This organization has the Government’s best interest in mind and understands the relevant issues, costs, and plans—and all work is performed onsite by contractor personnel to NASA standards. This work is essential for projects to accomplish build requirements on time and within budget.

The packaging and assembly group’s chief objective is to create and employ standardized processes and procedures for all NASA projects to ensure high-quality products and mitigate risks effectively. As a services organization, the group’s onsite capabilities save projects money and resources while providing experienced certified personnel who understand today’s complex, sophisticated parts from an engineering perspective, as well as the dynamics of vibration during launch and orbit. The staff also writes and manages tasks and works with offsite contractors to get the job done. Large contract vehicles are in place, and a blanket purchase agreement (BPA) can be set up for any customer.

Processes

The packaging and assembly group receives design schematics and parts from project engineers to build packages (i.e., boards, boxes, and cables and harnesses internal to the box), and returns the packages to the engineers to test. Changes are supported throughout the process.

Integration and test (I&T) organizations not involved with hardware build racks, cables and harnesses, and specialized equipment such as spacecraft interfaces and buses. The packaging and assembly group tests the interfaces with the buses, which constitute ground support equipment (GSE), and designs and builds boards for the box of electronics and associated GSE. Mechanical and packaging engineers support those efforts, as well as provide structural and thermal analysis and packaging engineering.

Printed wiring board (PWB) layout personnel use schematics to determine how to build boards, and they also handle placement of parts and internal connections.

Mechanical engineers design boxes, parameters, and mounting, and determine the space environment structure. The parts and box are procured, the machine shop cuts them to specification, and bare boards are sent for assembly. Harnessing and cabling are built and then returned to the engineers; once tested, the engineers return them to assembly personnel. When assembly is complete, the finished pieces are coated with a protective moisture-resistant compound, returned to the box, and subjected to environmental testing in thermal vacuum chambers (hot and cold temperatures, and vibration tests simulating launch and orbit).

Capabilities and Services

The packaging and assembly group features a large support base and fast turnaround time on work performed, both onsite and offsite. This versatile staff possesses superior technical capabilities and ISO 9001 and NASA certifications. Its primary contract vehicles are the Multidisciplinary Engineering Development Services (MEDS) and Mechanical Systems Engineering Services (MSES) contracts. The group coordinates among such contractors as QSS Group, Inc.; Orbital Sciences Corporation (OSC); Northrop Grumman; Swales Aerospace; and Science Applications International Corporation (SAIC).

The wide array of services offered includes the following:

    Project planning and management; task setup, management, and tracking. Cost and schedule development and tracking support, and detailed cost reporting (by individual component) and status reporting (to board level). Mechanical and thermal packaging engineering, and analysis to the component level. Packaging design (box, board, cable, harness, parts, and mechanical structure), electrical design, and enclosure design. Electronics packaging (complete engineering design and mechanical/thermal analysis). Printed wiring board (PWB) fabrication, layout, and drawings. Electrical and electronic assembly and inspection (PWB, surface-mount technology [SMT], ball grid array [BGA], conventional, and cables and harnesses). Examples of Successful Projects
      Composite Infrared Spectrometer (CIRS). Swift Burst Alert Telescope (BAT) (Problems solved: op-amps, vibration, parts and 28 V software databases). Mercury Laser Altimeter (MLA). Space Technology Five (ST-5). Mars Orbiter Laser Altimeter (MOLA) I and II. Microwave Anisotropy Probe (MAP). Infrared Array Camera (IRAC) (Problems solved: capacitors). Geoscience Laser Altimeter System (GLAS) (Problems solved: thermal). Facilities
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